TUNG, Bui Thanh; SUZUKI, Motohiro; KATO, Fumiki; NEMOTO, Shunsuke; AOYAGI, Masahiro. Heterogeneous integration approach based on flip-chip bonding and misalignment self-correction elements for electronics-optics integration applications. <b>Vietnam Journal of Mechanics</b>, Hanoi, Vietnam, v. 34, n. 4, p. 289–297, 2012. DOI: 10.15625/0866-7136/34/4/1760. Disponível em: https://vjmech.vast.vn/vjmech/article/view/1760. Acesso em: 8 nov. 2025.